Samsung Working at Feverish Pace to Land A13 Chip Orders From Apple
Jun. 26, 2018According to a report from DigiTimes, Samsung is hard at work at developing the InFO (Integrated Fan-Out) packaging technology which decreases the thickness of chip packaging while enhancing processor speed and improving power dissipation, with the ultimate goal of landing the orders for the A13 chips.Image only for representation purpose
As per insider sources, Samsung has also made bold claims about outpacing TSMC when it comes to the production of 7nm+ chips based on the EUV technology, which is an advanced method of printing the actual chip circuitry that also suffers from a host of issues such as low yield, quality risks and complex procedure. It must be noted that TSMC has already won the orders for the A12 chips, and is also in line to bag the contract for the A13 chips which might be based on the EUV 7nm+ process employing the InFO technology.
“The Korean tech giant has reportedly lowered its foundry quotes by 20% to attract orders from Qualcomm, Apple, Nvidia, and ASIC vendors, but with little response from them probably due to the risks involved”, read DigiTimes’ report. Samsung will reportedly test the next generation of mobile processors based on the 7nm+ EUV process in one of the Exynos processors for the upcoming Galaxy S10 smartphone, before commencing mass production for other companies.
